Properties
- Encapsulant application, specially used for connector sealant
- Structural bonding, used for optical product encapsulant and bonding
- Hybrid system, rapid curing, low CTE, applied for camera assembly in auto alignment process
- Dam-fill, high Ti, chip level encapsulant, high reliability
- 2:1 2K room temp. curing, applied in potting products, good adhesion to different surface finish
- Low curing temp., rapid curing, used for complicated environment, specially for sensitive device and component protection
- LED, sensors and multi-media modules assembly, optical sensitive devices with high reflectivity and good adhesion
- Suitable for water vapor prevention and bonding of electrical screens
fast curing at low temperature
- Hybrid system, FPC components encapsulant, high bonding strength, high reliability
- PCB encapsulant, applied in underfill and encapsulant applications
- Hybrid system, PCB and FPC encapsulant application, suitable for flexible circuit board such as screen display /modules and related circuit protection
- High SIR suits important micro-chips, like BGA /WLCSP /other protection
- FPC reinforcement, with good UV flexibility, suitable for encapsulation and other protection purposes
- Low organic-tin, no halogen, no depression
- Structural bonding
- Coating
- Modified silicane, low organic-tin, no halogen, no depression
- Matte, modified silicane, low organic-tin, no halogen,
- UV cured organic silicon, fast cure by UV light, used for FIPG process, high elongation
Product requirements form
