Properties
- Underfill, fast flow, easy to rework, high reliability
- Chip level Underfill, low CTE, high reliability, especially used for automotive/ semiconductive market application
- Fast flow, general Underfill used in various applications, easy to rework
- High reliability, non-reworkable, low outgassing
- Low halogen, easy to flow, very good compatibility to residue of flux
- Low cost, easy to rework, good compatibility to residue of flux
Product requirements form
