Recommendation:Full underfill ER6011
Properties: Fast flow in room temp., very good filling result, encapsulant for part of chips , easy to rework.
Recommendation:Corner bonding ER6116
Properties: Used for large chip corner bonding, reduce the local tension and stress of BGA caused by external forces, and form a cofferdam with higher viscosity and thixotropy to improve reliability.
Recommendation: ER6131
Properties:High Tg, Low CTE, significantly improve reliability, strong adhesion, non-reworkable.