Suzhou GiantBond New Material

Board level or chip level underfill

Board level

Recommendation：Full underfill ER6011

Properties: Fast flow in room temp., very good filling result, encapsulant for part of chips , easy to rework.

Recommendation：Corner bonding ER6116

Properties: Used for large chip corner bonding, reduce the local tension and stress of BGA caused by external forces, and form a cofferdam with higher viscosity and thixotropy to improve reliability.

Chip level

Recommendation： ER6131

Properties：High Tg, Low CTE, significantly improve reliability, strong adhesion, non-reworkable.

Encapsulant /sealant

USB/Speaker

Recommendation: ER6318 /ER6319

Properties: Good performance in encapsulant after curing, flexible sealant and reflow resistant, good compatibility to flux residue, conform to RoHS and Halogen free.

Single part, easy to dispense and fast cure.

Achieve IPx7 waterproof and sealing requirements of connector. Pass USB 5000-cycle sway test.

Withstand 2-3 times reflow soldering process, with complete structure and no air-leakage.

Reliability verification of the entire machine, meet the needs of mobile phones.

Chip protection

FPC reinforcement

Recommendation: AT3010/AT3096

Properties: Hybrid system, encapsulant application, applied to display module on FPC protection. After curing, FPC can be bended 90 degree more than 100 cycles on the thickness of 0.5mm and 1.0mm. It can be cured by moisture in shading area.

PCB encapsulant

Recommendation: ER6301

Properties: Chip encapsulant for collision force protection, dust prevention etc.
Enhancing adhesion and reliability in stress sensitive devices.

Parts bonding and in-process protection

Parts bonding

Recommendation: AT3014

Properties: UV fast cure, widely used for bonding of PVC and PC plastic materials, very good flexibility, improve bonding strength. Excellent adhesion to wide range of substrates including glass, plastics and metals etc.

Protection

Recommendation: AT3833

Properties: Used for protection process before CNC. Effectively form protection for the cut surface and pore structures. After rapid curing, it is easy to peel off and can be applied with machining and anodizing processes under various extreme conditions.

Structure bonding

Shell structure

Recommendation: PUR5011

Properties: Pressure sensitive hot melt adhesive can provide instant high initial strength with rapid curing process, high bonding strength for various materials and complex application scenarios.

Structural bonding screen /display products

Recommendation: PUR5601

Properties: Precision dispensing with high bonding strength and small line widths, specially for Al alloys and PC/PA/PET plastics. Viscosity can be adjusted for actual applications to meet the filling requirements of different gaps.